Current Status and Manufacturing Potential of Semiconductor Chips Across Countries Worldwide
Abstract:
Semiconductor manufacturing underpins digital economies, artificial intelligence, telecommunications, automotive systems and national technological security. This review examines the global semiconductor value chain, compares the strengths and constraints of major producing economies, and evaluates technological and industrial prospects for 2026–2035. It highlights advanced logic, memory, chiplets, compound semiconductors, supply-chain diversification and opportunities for Vietnam. The analysis distinguishes current industrial capabilities from future policy targets and emphasizes the importance of human resources, infrastructure and international cooperation.
KeyWords:
semiconductor chips; integrated circuits; CMOS; manufacturing; supply chains; advanced packaging; artificial intelligence.
References:
- Akinwande, D., Huyghebaert, C., Wang, C.-H., Serna, M. I., Goossens, S., Li, L.-J., Wong, H.-S. P., & Koppens, F. H. L. (2019). Graphene and two-dimensional materials for silicon technology. Nature, 573, 507–518. https://doi.org/10.1038/s41586-019-1573-9
- Armstrong (2025). Economic Security and New Industrial Policy. Asian Economic Policy Review.
- https://doi.org/10.1111/aepr.12502?utm_source=chatgpt.com
- Chen, Z. (2022). Gate-all-around nanosheet transistors go 2D. Nature Electronics, 5, 830–831. https://doi.org/10.1038/s41928-022-00899-4
- Das Sharma, D., & Mahajan, R. V. (2024). Advanced packaging of chiplets for future computing needs. Nature Electronics, 7, 425–427. https://doi.org/10.1038/s41928-024-01175-3
- Dennard, R. H., Gaensslen, F. H., Yu, H.-N., Rideout, V. L., Bassous, E., & LeBlanc, A. R. (1974). Design of ion-implanted MOSFETs with very small physical dimensions. IEEE Journal of Solid-State Circuits, 9(5), 256–268. https://doi.org/10.1109/JSSC.1974.1050511
- Hennessy, J. L., & Patterson, D. A. (2019). A new golden age for computer architecture. Communications of the ACM, 62(2), 48–60. https://doi.org/10.1145/3282307
- Jeong, H.-G. (2026). Global semiconductor supply chain risks: Challenges and strategic resilience. Asia & the Pacific Policy Studies, 13(3), e70046. https://doi.org/10.1002/app5.70046
- Jouppi, N. P., et al. (2017). In-datacenter performance analysis of a tensor processing unit. Proceedings of the 44th Annual International Symposium on Computer Architecture, 1–12. https://doi.org/10.1145/3079856.3080246
- Kim, D., & Kim, J. Y. (2022). DRAM-based processing-in-memory. In Processing-in-Memory for AI: From Circuits to Systems (pp. 65–91). Springer. https://doi.org/10.1007/978-3-030-98781-7_4
- Lau, J. H. (2021). State-of-the-art and outlooks of chiplets heterogeneous integration and hybrid bonding. Journal of Microelectronics and Electronic Packaging, 18(4), 145–160. https://doi.org/10.4071/imaps.1542066
- Li, P., Liu, Q., Chen, T., Shen, J., Lv, P., & Guo, W. (2024). Research on the heterogeneous integrated interconnect interface. Integrated Circuits and Embedded Systems, 24(2), 31–40. https://doi.org/10.20193/j.ices2097-4191.2024.02.004
- Li, T., Hou, J., Yan, J., Liu, R., Yang, H., & Sun, Z. (2020). Chiplet heterogeneous integration technology—Status and challenges. Electronics, 9(4), 670. https://doi.org/10.3390/electronics9040670
- Liu, X., et al. (2026). Fault modeling, testing, and repair for chiplet interconnects. Chip, 100160. https://doi.org/10.1016/j.chip.2025.100160
- Liu, M. (2021). Taiwan and the foundry model. Nature Electronics, 4, 318–320. https://doi.org/10.1038/s41928-021-00576-y?utm_source=chatgpt.com
- Mahajan, R. V., et al. (2026). The heterogeneous integration of electronic components. Nature Reviews Electrical Engineering, 3, 254–263. https://doi.org/10.1038/s44287-026-00270-1
- Ministry of Electronics and Information Technology. (2025, April 2). Government of India spurs chip manufacturing with fiscal support, global MoUs and talent development initiatives. Press Information Bureau, Government of India. https://www.pib.gov.in/Pressreleaseshare.aspx?PRID=2117925&lang=2®=48&utm_source=chatgpt.com
- Ministry of Electronics and Information Technology. (2025, April 2). Government of India spurs chip manufacturing with fiscal support, global MoUs and talent development initiatives. Press Information Bureau, Government of India. https://www.pib.gov.in/Pressreleaseshare.aspx?PRID=2117925&lang=2®=48&utm_source=chatgpt.com
- Moktadir, M. A., & Ren, J. (2024). Global semiconductor supply chain resilience challenges and mitigation strategies: A novel integrated decomposed fuzzy set Delphi, WINGS and QFD model. International Journal of Production Economics, 273, 109280. https://doi.org/10.1016/j.ijpe.2024.109280
- Moore, G. E. (1998). Cramming more components onto integrated circuits. Proceedings of the IEEE, 86(1), 82–85. https://doi.org/10.1109/JPROC.1998.658762
- Moutanabbir, O., & Gösele, U. (2010). Heterogeneous integration of compound semiconductors. Annual Review of Materials Research, 40, 469–500. https://doi.org/10.1146/annurev-matsci-070909-104448
- Mu, Z., Zhou, H., Yang, Y., Liu, Q., Wei, X., & Yu, W. (2023). Junctionless nanosheet gate-all-around transistors fabricated on void embedded silicon on insulator substrate. Electronics Letters, 59, e212740. https://doi.org/10.1049/ell2.12740
- Novoselov, K. S., Geim, A. K., Morozov, S. V., Jiang, D., Zhang, Y., Dubonos, S. V., Grigorieva, I. V., & Firsov, A. A. (2004). Electric field effect in atomically thin carbon films. Science, 306(5696), 666–669. https://doi.org/10.1126/science.1102896
- Prime Minister of Vietnam. (2024a). Decision No. 1018/QD-TTg on Vietnam's semiconductor industry development strategy through 2030, with a vision to 2050. Government of Vietnam. https://vanban.chinhphu.vn/?classid=0&docid=211240&pageid=27160&utm_source=chatgpt.com
- Prime Minister of Vietnam. (2024b). Decision No. 1017/QD-TTg approving the semiconductor industry human resources development program through 2030, with an orientation toward 2050. Government of Vietnam. https://vanban.chinhphu.vn/?docid=211239&pageid=27160&tagid=7&type=1&utm_source=chatgpt.com
- Radisavljevic, B., Radenovic, A., Brivio, J., Giacometti, V., & Kis, A. (2011). Single-layer MoS2 transistors. Nature Nanotechnology, 6, 147–150. https://doi.org/10.1038/nnano.2010.279
- Rafiee, M., & Saini, P. (2026). Advanced semiconductor packaging design via artificial intelligence and machine learning: A review. Microelectronics Reliability, 181, 116145. https://doi.org/10.1016/j.microrel.2026.116145
- Ramirez, Z. R., & Le, T. V. (2025). Semiconductor supply chain resilience: Systematic review, conceptual framework, implementation challenges, and future research directions. Computers & Industrial Engineering, 210, 111518. https://doi.org/10.1016/j.cie.2025.111518
- Schwierz, F. (2010). Graphene transistors. Nature Nanotechnology, 5, 487–496. https://doi.org/10.1038/nnano.2010.89
- Semiconductor Industry Association. (2026, February 6). Global annual semiconductor sales increase 25.6% to $791.7 billion in 2025. https://www.semiconductors.org/global-annual-semiconductor-sales-increase-25-6-to-791-7-billion-in-2025
- Sivakumar, P., Dargar, S. K., & Harikrishnan, P. (2026). Technology computer-aided design (TCAD) for simulation of advanced transistor design. In Micro and nano semiconductor devices for digital, analog and sensor design. Wiley. https://doi.org/10.1002/9781394307340.ch6?utm_source=chatgpt.com
- Tung, A.-C. (2001). Taiwan's semiconductor industry: What the state did and did not. Review of Development Economics, 5(2), 266–288. https://doi.org/10.1111/1467-9361.00123?utm_source=chatgpt.com
- Waldrop, M. M. (2016). The chips are down for Moore’s law. Nature, 530, 144–147. https://doi.org/10.1038/530144a
- Wu, S.-Y., Hung, S.-C., & Lin, B.-W. (2006). Agile strategy adaptation in semiconductor wafer foundries: An example from Taiwan. Technological Forecasting and Social Change, 73(4), 436–451. https://doi.org/10.1016/j.techfore.2005.01.004?utm_source=chatgpt.com
- Zhang, S., Li, Z., Zhou, H., Li, R., Wang, S., Paik, K.-W., & He, P. (2022). Challenges and recent prospectives of 3D heterogeneous integration. e-Prime—Advances in Electrical Engineering, Electronics and Energy, 2, 100052. https://doi.org/10.1016/j.prime.2022.100052